A team from the University of Glasgow has created the world’s first fully 3D-printed microscope, lenses and all. It costs less than £50 and can be built in hours. The project is already expanding access to microscopy in West Africa and changing how science is taught.
The latest LLVM compiler toolchain is here, and it’s a significant one for the RISC-V ecosystem. Qualcomm’s custom extension is moving out of experimental status, signaling serious hardware commitment.
Apple’s 2013 “Trashcan” Mac Pro was a bold, quiet, and compact design that famously backfired due to a lack of upgradability. Now, with Apple facing criticism over AI stagnation, there’s a call for a new, corrected version of that daring hardware philosophy.
New leaks reveal the exact, unconventional shape of Apple’s long-rumored foldable iPhone. It sets up a fascinating design battle with Samsung’s Galaxy Z Fold line for the future of big-screen phones.
AMD is laying the groundwork for its Zen 6 architecture by getting it into a major open-source compiler. The initial “Znver6” support patch has been merged into the GCC 16 toolchain. This early move helps developers prepare software optimizations well before the chips launch in late 2026.
Texas Attorney General Ken Paxton has filed lawsuits against five major TV manufacturers. He alleges they use hidden technology to capture screenshots of user viewing habits without consent. The lawsuits highlight a growing privacy battle over smart device data collection.
Xiaomi’s next camera-centric flagship, the 17 Ultra, is getting a global version. FCC certification for model 2512BPNDAG confirms it will launch internationally with Android 16 and HyperOS 3.
A new partnership aims to tackle the massive energy needs of AI data centers. Addionics and PNT are joining forces to develop and manufacture cheaper, high-performance LFP battery cells for large-scale energy storage systems.
The AI boom is moving from training models to running them, and the hardware needs are shifting fast. Now, NVIDIA and SK hynix are reportedly teaming up on a new type of storage to fuel that next phase, and it could upend the entire memory market.
According to a new leak, Apple’s long-rumored foldable iPhone is shaping up with some surprising compromises. To achieve a thin profile, the device may skip Face ID entirely in favor of a side-mounted Touch ID sensor.
