Salute Launches Direct-to-Chip Liquid Cooling Service

According to DCD, Salute has launched a direct-to-chip liquid cooling service specifically designed for AI and high-performance computing environments. The company describes the solution as “the first of its kind” and claims it’s already working with several data center operators including Applied Digital, Compass Datacenters, and SDC. This development signals a significant shift in how the industry approaches thermal management for power-intensive workloads.

Understanding the Direct-to-Chip Cooling Challenge

Traditional data center cooling methods are hitting physical limits with the power densities required by modern AI chips. While direct-to-chip liquid cooling isn’t new technology, what makes this service noteworthy is the operational expertise layer. Most companies understand the technical principles of liquid cooling, but few have developed the comprehensive operational procedures, safety protocols, and risk mitigation strategies needed for enterprise-scale deployment. The transition from air to liquid cooling represents a fundamental shift in data center operations that requires specialized knowledge beyond just the cooling technology itself.

Critical Analysis of the Service Model

While Salute’s approach addresses genuine operational gaps, several challenges remain unaddressed in their announcement. The biggest question is whether their standardized procedures can effectively account for the diverse hardware configurations across different data center environments. AI infrastructure isn’t monolithic—different GPU architectures, server designs, and workload patterns create unique thermal management requirements. Additionally, the service’s effectiveness depends heavily on the quality of their partnerships with CDU manufacturers and leak management vendors. Any weaknesses in these third-party relationships could compromise the entire service delivery model. The mention of supporting 3,300MW by 2027 also raises questions about scalability—whether they can maintain service quality while rapidly expanding their operational footprint.

Industry Impact and Market Positioning

Salute’s service represents a maturation of the AI infrastructure market where operational expertise becomes as valuable as the hardware itself. This development creates a new service category that could pressure both traditional data center operators and cooling technology vendors to develop similar operational capabilities. The timing is strategic—as AI chip power consumption continues to increase (with some chips approaching 1000W), liquid cooling transitions from optional to mandatory. Salute’s early mover advantage with major operators gives them significant market positioning, but they’ll face competition from both established facilities management companies and specialized engineering firms entering this space.

Future Outlook and Market Evolution

The rapid adoption timeline Salute outlines—from 260MW to 3,300MW by 2027—suggests we’re approaching a tipping point for liquid cooling in AI infrastructure. However, the real test will come when these systems face real-world stress conditions beyond controlled deployments. The market will likely see consolidation as smaller players struggle to match the operational expertise and insurance requirements for large-scale liquid cooling deployments. Looking forward, the success of services like Salute’s will depend on their ability to continuously adapt to new chip architectures and cooling technologies while maintaining rigorous safety standards across geographically distributed operations.