AMD Helios AI Rack: The Open Standard Powerhouse for Next-Gen AI Workloads
The Dawn of Open AI Infrastructure In a significant move that could reshape the artificial intelligence infrastructure landscape, Meta and…
The Dawn of Open AI Infrastructure In a significant move that could reshape the artificial intelligence infrastructure landscape, Meta and…
ASUS has begun deploying beta BIOS updates featuring AMD’s latest AGESA 1.2.7.0 firmware for its AM5 800-series motherboards. The new firmware reportedly includes optimized support for upcoming Ryzen APUs expected to feature Zen 5 CPU cores and enhanced RDNA graphics.
ASUS is preparing its AM5 800-series motherboards for AMD’s upcoming Ryzen APU lineup through new beta BIOS releases, according to recent reports. The motherboard manufacturer has begun distributing BIOS updates featuring AMD’s latest AGESA 1.2.7.0 firmware, which sources indicate contains optimized support for next-generation APUs expected to launch later this year.
Xbox Confirms Next-Gen Console Development Amid Industry Speculation Microsoft has officially confirmed that next-generation Xbox hardware is currently in development,…
Xbox President Sarah Bond has confirmed the company is actively developing next-generation hardware while expanding handheld gaming options. Microsoft’s partnership with AMD signals significant hardware advancements ahead, alongside software optimizations for portable gaming experiences.
Xbox President Sarah Bond has confirmed that Microsoft is fully committed to developing new gaming hardware, according to reports from Variety. “We are 100% looking at making things in the future,” Bond stated in the interview, directly addressing speculation about Microsoft’s hardware direction following recent third-party handheld releases.
Framework’s CEO has detailed the company’s strategy for modular, upgradeable laptops with swappable GPUs. The interview reveals insights into thermal management challenges and future partnerships with chip manufacturers. Framework continues pushing the boundaries of modular design in personal computing.
In a recent industry discussion, Framework CEO Nirav Patel outlined the company’s continued commitment to creating fully modular and repairable computing devices. According to reports, Framework has expanded its lineup to include multiple form factors while maintaining its core philosophy of user-upgradeable components.
AMD Revolutionizes Software Development with Parallel ROCm Release Strategy AMD has introduced a groundbreaking approach to its ROCm software platform…
The Open Ethernet Movement Gains Momentum In a significant industry shift, technology leaders including Meta, Nvidia, AMD, Cisco, and OpenAI…
MSI’s New Enthusiast-Grade Mini-ITX Powerhouse MSI has officially launched the MPG X870I EDGE TI EVO WiFi, a compact motherboard that…
AMD’s Vision for Open AI Infrastructure At the recent 2025 Open Compute Project Global Summit, AMD unveiled its groundbreaking “Helios”…
Taiwan Semiconductor Manufacturing Company has announced what analysts are calling a historic financial quarter, with revenue reportedly surging over a third year-over-year. The semiconductor giant’s performance appears driven by continued strong demand for advanced 3nm and 5nm process technologies, particularly from the artificial intelligence sector and major consumer electronics brands.
Taiwan Semiconductor Manufacturing Company (TSMC) has posted what sources indicate are record-breaking financial results for the third quarter of 2025, according to reports from the company. The semiconductor manufacturing leader reportedly achieved revenues of approximately $27.6 billion, representing growth of more than a third compared to the same period last year. Profit figures were equally impressive, reportedly jumping nearly 40 percent to reach roughly $12.6 billion, according to the analysis of the company’s financial disclosures available through their official earnings release.